光电器件管壳的双脉冲电镀工艺  

Double-pulsed Electroplating for Package of Optoelectronic Devices

作　　者：江德凤[1] 

机构地区：[1]重庆光电技术研究所,重庆400060

出　　处：《半导体光电》2002年第6期424-425,428,共3页Semiconductor Optoelectronics

摘　　要：分析了脉冲电流对金属沉积过程的影响。采用双脉冲电镀法 ,进行了在光电器件管壳上镀镍和镀金实验 ,并通过适当控制其正负脉冲电流密度、导通及关断时间等参数 ,获得了光亮、结晶致密、耐高温。The effect of pulsed current on metal deposition is analyzed. An experiment of nickel coating and gold coating on the package of optoelectronic devices was carried out by using double pulsed electroplating. The temperature and corrosion resistant coated layers with a fine luster and good compactness were obtained by means of proper control of pulsed current density, and on and off time, etc.

关 键 词：双脉冲电镀 传质 吸脱附 

分 类 号：TN491[电子电信—微电子学与固体电子学]