Micropolar interface model of thin-layered interconnection components with heterogeneous internal microstructures  

作　　者：张燕 樊靖郁 

机构地区：[1]Key Laboratory of Advanced Display and System Applications,School of Mechatronics Engineering and Automation,Shanghai University [2]Shanghai Institute of Applied Mathematics and Mechanics,Shanghai University

出　　处：《Journal of Shanghai University(English Edition)》2009年第5期345-348,共4页上海大学学报（英文版）

基　　金：supported by the National Natural Science Foundation of China (Grant No.10702037);the Shanghai Pujiang Program(Grant No.08PJ14054);the Innovation Program of Shanghai Municipal Education Commission (Grant No.09YZ01)

摘　　要：Being a wide variety of thin-layered interconnection components in electronics packaging with relatively small scale and heterogeneous materials, conventional numerical methods may be time consuming and even inefficacious to obtain an accurate prediction for the interface behavior under mechanical and/or thermal loading. Rather than resort to a fully spatial discretization in the vicinity of this interface zone, an interface model was proposed within the framework of micropolar theory by introducing discontinuous approximation. A fracture description was used to represent the microscopic failure progress inside the interface. The micropolar interface model was then numerically implemented with the finite element method. As an application, the interface behavior of a packaging system with anisotropic conductive adhesive (ACA) joint was analyzed, demonstrating its applicability and great efficiency.Being a wide variety of thin-layered interconnection components in electronics packaging with relatively small scale and heterogeneous materials, conventional numerical methods may be time consuming and even inefficacious to obtain an accurate prediction for the interface behavior under mechanical and/or thermal loading. Rather than resort to a fully spatial discretization in the vicinity of this interface zone, an interface model was proposed within the framework of micropolar theory by introducing discontinuous approximation. A fracture description was used to represent the microscopic failure progress inside the interface. The micropolar interface model was then numerically implemented with the finite element method. As an application, the interface behavior of a packaging system with anisotropic conductive adhesive (ACA) joint was analyzed, demonstrating its applicability and great efficiency.

关 键 词：interface model micropolar theory discontinuous approximation 

分 类 号：TN05[电子电信—物理电子学]