溅射沉积Cu-W合金薄膜的结构及力学性能  

Structure and Mechanical Properties of Cu-W Alloy Thin Films Deposited by Sputtering

作　　者：郭中正[1] 孙勇[1] 段林昆[1] 郭诗玫[2] 李玉阁[1] 

机构地区：[1]昆明理工大学云南省新材料制备与加工重点实验室,云南昆明650093 [2]曲靖师范高等专科学校,云南曲靖655000

出　　处：《稀有金属》2010年第1期38-43,共6页Chinese Journal of Rare Metals

基　　金：云南省自然科学基金重点资助项目(2004E0004Z);国家自然科学基金(50871049);云南省自然科学基金(2006E0018Q)资助

摘　　要：用磁控共溅射法制备Cu-W合金薄膜,运用EDX,XRD,TEM,SEM和纳米压痕仪对薄膜成分、结构和力学性能及其关系进行了研究。结果表明,含W较低的Cu82.1W17.9(%,原子分数)和W浓度较高的Cu39.8W60.2薄膜为晶态结构且出现固溶度扩展,分别存在fccCu(W)亚稳过饱和固溶体(固溶度4.8%W)和bccW(Cu)亚稳过饱和固溶体(固溶度5.7%Cu),W含量为31.8%,45.7%,54.8%的Cu-W薄膜呈非晶态,表面粗糙度较晶态Cu-W薄膜低。总体上非晶Cu-W薄膜弹性模量E和硬度H值较低,fccCu-W膜实测E值介于Voigt和Reuss规则预测值之间,bcc和非晶Cu-W膜实测E值分别高于和低于预测值;晶态Cu-W膜实测H值与Voigt规则计算值的符合性优于非晶膜,薄膜结构对力学性能预测可靠性影响较大。The composition,structure,mechanical properties of Cu-W alloy thin films fabricated by magnetron co-sputtering were investigated by EDX,XRD,TEM,SEM and nanoindenter. The results showed that Cu82.1W17.9(%,atom fraction) with lower W content and Cu39.8W60.2 with higher W concentration thin films were of crystalline state with the presence of fcc Cu(W) metastable supersaturated solid solution with maximum W solubility of 4.8% and bcc W(Cu) metastable supersaturated solid solution with maximum Cu solubility of ...

关 键 词：Cu-W合金薄膜 微观结构 非晶态 力学性能 

分 类 号：TB381[一般工业技术—材料科学与工程]