U盘上盖的翘曲变形分析与工艺参数优化  

Warpage analysis and process parameter optimization of U-disk cap molding

作　　者：董娇[1] 王雷刚[1] 黄瑶[1] 

机构地区：[1]江苏大学材料科学与工程学院,江苏镇江212013

出　　处：《模具技术》2010年第2期8-11,共4页Die and Mould Technology

摘　　要：以U盘上盖的注塑成型为实例,运用Taguchi试验设计法,结合信噪比(S/N)和变量分析方法(ANOVA),以减少塑件的翘曲量为目的,研究熔体温度、模具温度、保压压力和保压时间等工艺参数对塑件翘曲的影响,分析各工艺参数的影响程度,并优化成型工艺。结果表明:保压压力、熔体温度对塑件翘曲变形影响最大,优化后的塑件翘曲量降低了约16%。Taking the injection molding of USB flash disk cap as an example,using Taguchi method combined with signal-to-noise(S/N) ratio and variable analysis method(ANOVA),on the purpose of reducing warpage of injection parts,the influence of process parameters on warpage was investigated,which included melt temperature,mold temperature,holding pressure and holding time.The influence of each parameter was analyzed,and the forming process was optimized.Results showed that holding pressure and mold temperature had gre...

关 键 词：Taguchi试验设计 翘曲变形 工艺优化 变量分析 

分 类 号：TQ320.662[化学工程—合成树脂塑料工业]