半模基片集成波导互耦的仿真与分析  

Simulation and Analysis of Coupling Between Half Mode Substrate Integrated Waveguides

作　　者：盖政祥[1] 李平辉[2] 丛志鹏 王建功[1] 

机构地区：[1]解放军理工大学通信工程学院研究生2队 [2]解放军理工大学通信工程学院卫星通信系 [3]中国人民解放军73691部队

出　　处：《军事通信技术》2008年第1期81-83,105,共4页Journal of Military Communications Technology

摘　　要：利用等效磁壁而提出的半模基片集成波导能够将原基片集成波导的尺寸、重量减半,便于电路的小型化和集成化,因而研究这种结构在集成电路中的互耦现象十分必要。文中对同一个微波集成电路中相邻的两个半模基片集成波导以及改进的半模基片集成波导的互耦现象进行了仿真与分析。仿真结果表明,反向和同向排列方式受互耦的影响较小,并且改进后的半模基片集成波导结构能明显减弱互耦现象的影响。The Half Mode Substrate Integrated Waveguide (HMSIW) which uses magnetic wall can reduce the size and weight of Substrate Integrated Waveguide (SIW) by half.Because of the easy integration,it is necessary to research the coupling between two HMSIW in integrated circuit.In this paper,the coupling between two HMSIW and improved HMSIW was simulated and analyzed.The simulation results show that the effect of coupling between HMSIW arrayed in face-to-face and face-to-back way is little and can be weakened obviously by using the improved HMSIW.

关 键 词：基片集成波导 半模基片集成波导 磁壁 互耦 

分 类 号：TN8[电子电信—信息与通信工程]