低温烧结Dy-B-Si-O系玻璃介质掺杂Ba_(0.6)Sr_(0.4)TiO_3陶瓷  

Dy-B-Si-O glass additive decreased sintered temperature of Ba_(0.6)Sr_(0.4)TiO_3 ceramic

作　　者：吴凯卓[1] 马铁成[1] 刘贵山[1] 冯俊[1] 杨兰贺[1] 姜宏阳[1] 

机构地区：[1]大连工业大学纺织与材料工程学院,辽宁大连116034

出　　处：《大连工业大学学报》2012年第1期53-55,共3页Journal of Dalian Polytechnic University

摘　　要：采用溶胶-凝胶法制备了Dy-B-Si-O系玻璃介质掺杂Ba0.6Sr0.4TiO3(BST)陶瓷粉体,并烧结成瓷。探讨了玻璃介质对BST陶瓷密度、烧结温度和介电性能的影响,利用扫描电子显微镜(SEM)、自动元件分析仪测试了BST陶瓷的显微结构和介电性能。研究结果表明,添加Dy-B-Si-O系玻璃介质降低了陶瓷烧结温度,提高了陶瓷致密度;随着Dy-B-Si-O系玻璃介质中Dy2O3组分含量的增加,介电常数增大;介电损耗先增大后减小,介电损耗最小值约为0.01,可满足在电压可调电容器上的使用要求。Dy-B-Si-O glass-doped Ba0.6Sr0.4TiO3 ceramics powders were prepared by sol-gel method and sintered.Effects of Dy-B-Si-O glass additive on density,sintering temperature and dielectric properties of BST ceramics were investigated.The results showed that the sintering temperature of BST ceramics decreased and the density improved.Furthermore,the dielectric constant was increased with the increasing of Dy2O3 content in Dy-B-Si-O glass additive.The dielectric loss initially increased and then reduced to 0.01,which met the demand of application in voltage adjustable capacitor.

关 键 词：钛酸锶钡 陶瓷 玻璃介质 介电性能 

分 类 号：TQ174[化学工程—陶瓷工业]