SFP光模块PCB制作工艺研究  

A study to the fabrication process of PCB used in SFP optical module

作　　者：安国义 严来良 李长生 文泽生 

机构地区：[1]深圳市深联电路有限公司,广东深圳518104

出　　处：《印制电路信息》2012年第8期30-33,54,共5页Printed Circuit Information

摘　　要：在SFP光模块PCB高速/高频信号传输存在趋肤效应的条件下,分析了"镀水金+镀厚金"常规工艺信号传输线镀覆镍金对信号传输的影响,研究出"镀厚金+沉金"工艺,实现了信号传输线无镀覆镍金,有利于信号完整性控制,并保证了PCB长短金手指完整性良好(无残缺、无残留镀金导线头、无尖角等异常)。Under the condition of skin effect which exists in the transmission of high speed/high-frequency signal,this paper analyzes the effect of signal transmission line plated by Nickel-Gold to the signal transmission which is produced by conventional 'Flash Gold + Hard Gold' technique,proposes a new technic 'Hard Gold + Immersion Gold',fulfills no Nickel-Gold plating on signal transmission line,benefits the control of signal integrity as well as the appearance integrity of long/short gold finger(no defects,no residual gold-plating lead head,no acute corners or other abnormal results).

关 键 词：SFP光模块 长短印制插头(金手指) 趋肤效应 

分 类 号：TN41[电子电信—微电子学与固体电子学]