硫脲掩蔽-络合滴定法测定化学镀铜废液中EDTA的探讨与研究  

Discussion and research of Thiourea masking——complexometric titration method for the determination of EDTA in the electroless copper plating waste

作　　者：张优珍 彭义华 

机构地区：[1]深圳市危险废物处理站,广东深圳518049

出　　处：《印制电路信息》2012年第10期47-49,51,共4页Printed Circuit Information

摘　　要：文章从分析技术层面探讨和研究了分别用铋和锌两种标准溶液测定化学镀铜废液中EDTA的方法,解决了标准滴定液、测定溶液酸度、指示剂的选择及消除铜干扰的问题。试验表明该方法操作简单、快速灵敏、准确。From the analysis of the technical level,this article is to explore and study the determination of EDTA in the electroless copper plating wastewater with bismuth and zinc respectively,which are two standard solutions.It also to solve the standard titrant determination of the solution acidity,the indicator selection and the elimination of copper interference.The experiments show that the method is simple,fast and sensitive,accurate.

关 键 词：化学镀铜废液 络合滴定法 铋、锌标准溶 EDTA 

分 类 号：TN41[电子电信—微电子学与固体电子学]