树脂结合剂金刚石砂轮精密磨削单晶硅片的磨削力研究  

Research on the grinding force when machining monocrystalline silicon wafer with resin-bonded diamond grinding wheel

作　　者：林培勇[1] 魏昕[1] 陈卓[1] 任庆磊[1] 董成祥[1] 

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《金刚石与磨料磨具工程》2012年第4期19-21,26,共4页Diamond & Abrasives Engineering

基　　金：国家自然科学基金项目(NO.U0734008);广东省自然科学基金资助项目(NO.8151009001000048)

摘　　要：通过对树脂结合剂金刚石砂轮磨削单晶硅片的轴向磨削力Fz的变化规律的研究,分析了单晶硅片在磨削过程中轴向磨削力与磨削工艺参数之间的关系。通过改变砂轮的轴向进给速度、砂轮线速度和砂轮粒度等工艺参数,找出了这些工艺参数对轴向磨削力Fz的影响规律,并建立了轴向磨削力的经验公式。结果表明:树脂结合剂金刚石精密磨削单晶硅片时,轴向磨削力随着砂轮的轴向进给速度vf和磨粒粒径的增大而增大,随着砂轮线速度vs的增大而减小,且这三个工艺参数中,砂轮轴向进给速度vf对轴向磨削力的影响最大。Grinding experiments of silicon wafer with diamond grinding wheel was conducted,the grinding forces were tested.The effects of the condition parameters,such as axial feed rate,grinding speed and the diamond grit size,on axial grinding force were analyzed.The relationship between the axial grinding force Fz and condition parameters were obtained by the empirical formula.The research results showed that the grinding force increased with the increase of the axial feed rate and the diamond grit size,but decreased with the increase of grinding speed of the wheel.The results also indicated that the axial feed rate vf had the most significant effect on the axial grinding force.

关 键 词：单晶硅 磨削力 金刚石砂轮 精密磨削 

分 类 号：TG580.6[金属学及工艺—金属切削加工及机床]