高速研磨聚晶金刚石实验研究  

Experimental study on high speed lapping of polycrystalline diamond

作　　者：孙国栋[1] 黄树涛[1] 周丽[1] 许立褔[1] 

机构地区：[1]沈阳理工大学机械工程学院,沈阳110159

出　　处：《金刚石与磨料磨具工程》2012年第5期27-30,共4页Diamond & Abrasives Engineering

基　　金：辽宁省教育厅科技创新团队项目(LT2010089)

摘　　要：使用金刚石砂轮研磨聚晶金刚石(PCD),对研磨速度对聚晶金刚石去除率及其表面质量的影响进行了研究。结果表明:聚晶金刚石的去除率随着研磨速度的增加逐渐提高。通过对比在不同研磨速度下加工的聚晶金刚石表面粗糙度,发现聚晶金刚石的表面粗糙度随着研磨速度的增加逐渐降低。随着研磨速度的提高,热化学去除和机械热去除成为主要的去除方式,聚晶金刚石的表面形貌逐渐呈平滑状,且平滑区域随着研磨速度的增加逐渐扩大。The influences of lapping speed on the removal rate and the surface quality of PCD were researched by experiments of lapping polycrystalline diamond(PCD) with diamond grinding wheel.The experimental results showed that the removal rate of PCD gradually improved with the increase of lapping speed.By comparing the surface roughness of PCD which had been machined at different lapping speeds,it could be found that the surface roughness of polycrystalline diamond gradually decreased with the increase of lapping speed.The thermo-chemical and thermo-mechanical removal became the main removal ways with the increase of lapping speed,while the surface topography of PCD gradually became smooth and the surface smooth areas of PCD gradually expended with the increase of lapping speed.

关 键 词：聚晶金刚石 高速研磨 材料去除率 表面微观形貌 

分 类 号：TQ164[化学工程—高温制品工业]