硅晶体线切割液的研究进展与发展趋势  

Progress and development trends of cutting fluid for multi-wire sawing process

作　　者：熊次远 李庆忠 钱善华 闫俊霞 

机构地区：[1]江南大学机械工程学院,江苏无锡214122

出　　处：《金刚石与磨料磨具工程》2012年第5期46-51,共6页Diamond & Abrasives Engineering

基　　金：国家自然科学基金项目(51175228);2011年度江苏省研究生创新工程项目

摘　　要：多线切割适用于切割大而薄的硅片,被广泛应用于硅晶体的工业生产中,而切割液对加工过程有着重要的影响。首先,阐述了切割液的作用机理;其次,对切割液的组成及工艺参数对切割液影响的研究现状分别进行了综述,指出了当前硅晶体切割液存在的一些问题,并指出了今后的发展趋势。With the advantages of cutting large diameter and very thin wafers,multi-wire saw is widely used as a leading method for silicon crystal slicing.The cutting fluid plays an important role in the machining process.First,the mechanism of cutting fluid was discussed.Second,the composition of the cutting fluid and the impact of process parameters on cutting fluid were reviewed.Finally,the main problems and the future development direction of cutting fluid were pointed out.

关 键 词：多线切割 线切割液 工艺参数 组成配方 

分 类 号：TG48[金属学及工艺—焊接]