铜/金刚石复合材料热导率正交实验研究  

Thermal conductivity of Cu/diamond composites by orthogonal experiment method

作　　者：丁彬彬[1] 范广涵[1] 周德涛[1] 赵芳[1] 郑树文[1] 熊建勇[1] 宋晶晶[1] 喻晓鹏[1] 张涛[1] 

机构地区：[1]华南师范大学光电子材料与技术研究所,广州510631

出　　处：《金刚石与磨料磨具工程》2013年第1期6-9,共4页Diamond & Abrasives Engineering

基　　金：国家自然科学基金(61176043);广东省战略性新兴产业专项资金(2010A081002005;2011A081301003;2012A080304016)

摘　　要：采用高温高压法制备了铜/金刚石复合材料。通过正交实验法研究了复合材料中金刚石粒度的不同尺寸和对应的体积比、铜和金刚石的体积比及保压保温时间等各种因素对复合材料热导率的影响。结果表明:铜和金刚石的体积比因素对热导率的影响最大,而金刚石不同粒度的体积比影响最小。获得了基于提高复合材料热导率的最佳制备工艺条件是,配料中金刚石粒度尺寸为75μm和250μm,金刚石大小粒度的配料体积比为1∶4,铜和金刚石的配料体积比为7∶3和保压保温时间为2 h,该工艺条件下制备的复合材料热导率为238.18 W/(m.K)。Cu/diamond composites were prepared by high temperature and high pressure(HTHP) method.Factors including diamond grit size,the volume ratio of two sizes of diamond,the volume ratio of Cu and diamond,and the time of pressure maintaining and heat preservation were investigated to illustrate their influences on the thermal conductivity of composites based on orthogonal experiments.The results showed that the volume ratio of Cu and diamond was the most pivotal factor,while the volume ratio of two sizes of diamond was the least impact on the thermal conductivity.In order to improve the thermal conductivity of Cu/diamond composites,the optimized preparation process parameters were studied and obtained as follows: the volume ratio of large size(250 μm) diamond to the small size(75μm) diamond was 1∶ 4,the volume ratio of Cu and diamond was 7∶ 3,the time of pressure maintaining was 2 h.Under the optimized parameters,Cu/diamond composites with thermal conductivity of 238.18 W /(m·K) were obtained.

关 键 词：铜/金刚石复合材料 高温高压法 正交实验法 热导率 

分 类 号：TB331[一般工业技术—材料科学与工程]