金刚石表面化学镀镍的研究  

The electroless plating of Ni on the diamond surface

作　　者：姚怀[1] 祝要民[1] 朱广林[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003

出　　处：《金刚石与磨料磨具工程》2013年第2期27-30,共4页Diamond & Abrasives Engineering

基　　金：河南科技大学青年科学研究基金(2007QN0007)

摘　　要：为了解决金刚石工具中金刚石粉体的脱落现象,利用化学镀的方法成功对金刚石粉体进行了表面镀镍。实验研究了化学镀前的预处理工艺,并确定了化学镀镍的合理配方。通过X射线衍射(XRD)、扫描电镜(SEM)等分析手段,研究镀层的组织及表面形貌。结果表明:在单次化学镀中,金刚石粉体表面镀层相对均匀,镀层较薄,无杂质;进行二次化学镀后,粉体的XRD图谱中,镍相对于金刚石的衍射峰随着施镀次数的增加明显增强,其表面形貌显示,镀层厚度增加,金刚石棱角变得更加平滑,表面更加均匀致密,无孔隙现象出现。Nickel layer was plated on diamond powder surface by electroless plating in order to keep diamond powders from falling.The pretreatment process and plating formula were confirmed.The structure and surface morphology of the coating was investigated by XRD and SEM analysis.Results showed that the coating on the diamond surface was relatively thin,uniform and pure by first plating.In the second plating,the Ni peaks in X-ray diffraction patterns of powders were stronger with the increasing times of electroless plating.The substrate was completely coated with Ni.The coating was thicker and the edges of diamond became smoother.

关 键 词：化学镀 金刚石 镍镀层 

分 类 号：TQ153.3[化学工程—电化学工业]