Analysis of heat transfer of loop heat pipe used to cool high power LED  

作　　者：LU XiangYou HUA ZeZhao LIU MeiJing CHENG YuanXia 

机构地区：[1]School of Power Engineering,Shanghai University of Science and Technology,Shanghai 200093,China

出　　处：《Science China(Technological Sciences)》2009年第12期3527-3532,共6页中国科学（技术科学英文版）

基　　金：Supported by the National Natural Science Foundation of China(Grant No.50676063);the Shanghai Leading Academic Discipline Project(Grant No.S30503

摘　　要：A novel loop heat pipe (LHP) cooling device for high power LED is developed. The thermal capabilities, including startup performance, temperature uniformity and thermal resistance of the loop heat pipe under different heat loads and incline angles have been investigated experimentally. The obtained results indicate that the thermal resistance of the heat pipe heat sink is in the range of 0.19–3.1 K/W, the temperature uniformity in the evaporator is controlled within 1.5°C, and the junction temperature of high power LED can be controlled steadily under 100°C for a heat load of 100 W.

关 键 词：high power LED LOOP heat PIPE thermal resistance FLAT EVAPORATOR 

分 类 号：TB611[一般工业技术—制冷工程]