Scaling Behaviors of Surface Roughening of Cu Thin Films Deposited by Oblique Angle Deposition  

作　　者：Liu Bo Yang Jijun Tang Rui Xu Kewei 

机构地区：[1]Sichuan Univ, Key Lab Radiat Phys & Technol, Minist Educ, Inst Nucl Sci & Technol, Chengdu 610064, Peoples R China [2]Nucl Power Inst China, Sci & Technol Reactor Fuel & Mat Lab, Chengdu 610041, Peoples R China [3]Xi An Jiao Tong Univ, State Key Lab Mech Behav Mat, Xian 710049, Peoples R China

出　　处：《稀有金属材料与工程》2012年第S1期93-96,共4页Rare Metal Materials and Engineering

基　　金：NSFC(11075112,51101108);Specialized Research Fund for the Doctoral Program of Higher Education(new teachers,20100181120112);The National Basic Research Program of China(Grant No.2010CB631002)

摘　　要：Cu thin films with different thicknesses were deposited by magnetron sputtering at various oblique angle θ of incidence between the deposition flux and the substrate surface normal.Cross-section microstructure and surface morphology of the films were investigated by scanning electron microscope(SEM)and atomic force microscope(AFM),respectively.Then the scaling behaviors of film surface roughening were analyzed in terms of dynamic scaling theory.With the increasing of the deposition angle θ,the angleφbetween grain growth direction and substrate surface normal increased gradually.With increasing θ in the range of<50°,the roughness exponent α increased from 0.76 to 0.82 and the growth exponent β decreased from 0.42 to 0.35.However,when θ increased to 70°,α and β changed to 0.72 to 0.61,respectively.The evolution of the scaling exponents effectively revealed the fact that the film surface roughening arises from the competition between surface diffusion and shadowing effect.Cu thin films with different thicknesses were deposited by magnetron sputtering at various oblique angle θ of incidence between the deposition flux and the substrate surface normal.Cross-section microstructure and surface morphology of the films were investigated by scanning electron microscope(SEM)and atomic force microscope(AFM),respectively.Then the scaling behaviors of film surface roughening were analyzed in terms of dynamic scaling theory.With the increasing of the deposition angle θ,the angleφbetween grain growth direction and substrate surface normal increased gradually.With increasing θ in the range of&lt;50°,the roughness exponent α increased from 0.76 to 0.82 and the growth exponent β decreased from 0.42 to 0.35.However,when θ increased to 70°,α and β changed to 0.72 to 0.61,respectively.The evolution of the scaling exponents effectively revealed the fact that the film surface roughening arises from the competition between surface diffusion and shadowing effect.

关 键 词：CU THIN film surface SCALING OBLIQUE angle DEPOSITION 

分 类 号：TG146.4[一般工业技术—材料科学与工程]