浅析电镀工艺对渗镀影响  

Analysis of Plating Process Impact on Infiltration Plating

作　　者：钟志欣 

机构地区：[1]深圳市华丰电器器件制造有限公司

出　　处：《印制电路信息》2009年第S1期213-216,共4页Printed Circuit Information

摘　　要：近几年来,线路板印刷在单位面积内线路密度越来越大,线宽越来越精细。渗镀对这类线路影响最至命,一旦有渗镀就会产生短路,短路直接影响成品合格率。渗镀产生主要原因有:图形转移工序贴膜前处理、贴膜前温度、贴膜压力、曝光能量。本文从电镀工艺中分析导致渗镀的原因:镀铜前处理、电镀锡缸阴阳面积比。In recent years,the printed circuit board in line density per unit area increases with more and more fine line design.Infiltration plating is critical because if there is infiltration plating,it will result in short issue which has direct impact on the passing rate of finished products.The major causes of infiltration plating are:pre-treatment of film lamination,temperature of film pre-lamination,pressure of film lamination,energy of exposure.This article analyzes the reasons leading to infiltration plating by getting into the plating process factors:pre-treatment of plating,electroplating tin cylinder area ratio of negative and positive.

关 键 词：渗镀 镀铜前处理 温度 振动强度 锡缸阴阳面积比 

分 类 号：TN41[电子电信—微电子学与固体电子学]