UV激光在SMT分板中的应用研究  

Application Research of UV Laser in SMT

作　　者：许健伟 

机构地区：[1]广东深圳大族数控科技有限公司,广东深圳518057

出　　处：《印制电路信息》2009年第10期62-64,共3页Printed Circuit Information

摘　　要：伴随高密度电子组装技术的发展,印制电路板制作工艺变得越来越细微化,相应地对SMT工艺要求也变得越来越高。同时也大大的压缩PCB的成型空间,传统的机械成型方式已逐渐不能满足这类PCB的成型要求,文章针对以上问题,结合UV激光加工的具体测试实例,对此类特殊PCB的成型加工做详细分析与阐述。With the development of the high-density electronic assembly technology,PCB's process technics is becoming more and more fine.Accordingly,there are more demands in SMT.At the same time,it also greatly reduces the PCB's shaping space.The traditional mechanical way hasn't met gradually the demands of this type PCB's shape.Aiming at the above problem and combing the specific test case of UV laser processing,this paper illuminates and analyses the processing of such special PCB's forming in detail.

关 键 词：表面贴装技术 印制电路板 挠性电路板 紫外激光 

分 类 号：TN41[电子电信—微电子学与固体电子学]