Design and performance test of miniature capillary pumped loop for electronics cooling  

Design and performance test of miniature capillary pumped loop for electronics cooling

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作  者:万珍平 皮丕辉 付永清 汤勇 

机构地区:[1]School of Mechanical Engineering, South China University of Technology [2]School of Chemical Engineering, South China University of Technology

出  处:《Journal of Central South University》2008年第S2期235-239,共5页中南大学学报(英文版)

基  金:Project(50605023) supported by the National Natural Science Foundation of China

摘  要:Considering two characteristics of compact heat dissipation room and high heat flux, a novel miniature capillary pumped loop (MCPL) for electronics cooling was proposed. MCPL consists of evaporator, condenser, vapor and liquid line dissipates heat by boiling and condensation of working fluids with no extra power consumption. Working fluid circulation is ensured by vapor pressure and capillary head. Saturated wick screens vapor and liquid, and ensures one-way flow of working fluid with no extra valve. In order to promote heat dissipation capacity of MCPL, the intensified boiling and condensation structures are embedded into evaporator and condenser respectively, which are useful to increasing boiling and condensation efficiency. Startup and run characteristics are tested by experiments in the condition of different power inputs and working fluids. MCPL is capable of dissipating 80 W of thermal energy and keeping the bottom substrate temperature of evaporator at 80 ℃.Considering two characteristics of compact heat dissipation room and high heat flux, a novel miniature capillary pumped loop (MCPL) for electronics cooling was proposed. MCPL consists of evaporator, condenser, vapor and liquid line dissipates heat by boiling and condensation of working fluids with no extra power consumption. Working fluid circulation is ensured by vapor pressure and capillary head. Saturated wick screens vapor and liquid, and ensures one-way flow of working fluid with no extra valve. In order to promote heat dissipation capacity of MCPL, the intensified boiling and condensation structures are embedded into evaporator and condenser respectively, which are useful to increasing boiling and condensation efficiency. Startup and run characteristics are tested by experiments in the condition of different power inputs and working fluids. MCPL is capable of dissipating 80 W of thermal energy and keeping the bottom substrate temperature of evaporator at 80 °C.

关 键 词:electronic components MINIATURE CAPILLARY PUMPED loop heat DISSIPATION intensified BOILING CONDENSATION 

分 类 号:TB657.5[一般工业技术—制冷工程]

 

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