Nano-scratch study of molecular deposition (MD) films on silicon wafer using nanoindentation^1  

作　　者：WANG Deguo ZHANG Siwei GAO Manglai University of Petroleum, Beijing 102200, China 

出　　处：《Science China Mathematics》2001年第S1期326-329,共4页中国科学：数学（英文版）

基　　金：Project supported by the National Natural Science Foundation of China(Grant No.59735110)and the Institute of high Education Science Foundation established by the State Education Commission(Grant No.97042510)

摘　　要：Experiment of the molecular deposition (MD) films with and without alkyl terminal de-posited on the silicon wafer were conducted by using nanoindentation. It was found that MD filmsand alkyl terminated MD films exhibit higher critical load (scratch resistance or adhesive strength)and lower coefficient of friction compared with the silicon substrate. Critical load (scratch resis-tance) increases with the number of layers, and coefficients of friction of those MD film with alkylterminal are still best for the same layer of MD film.Experiment of the molecular deposition (MD) films with and without alkyl terminal de- posited on the silicon wafer were conducted by using nanoindentation. It was found that MD films and alkyl terminated MD films exhibit higher critical load (scratch resistance or adhesive strength) and lower coefficient of friction compared with the silicon substrate. Critical load (scratch resis- tance) increases with the number of layers, and coefficients of friction of those MD film with alkyl terminal are still best for the same layer of MD film.

关 键 词：MOLECULAR DEPOSITION (MD) FILMS silicon wafer NANOINDENTATION critical load friction 

分 类 号：TB383.1[一般工业技术—材料科学与工程]