THERMAL-CONDUCTIVITY MEASUREMENTS FOR FILLING MATERIALS FOR SLIDING GATES AND THEIR EFFECTS ON FREE- TAPPING PERFORMANCE OF STEEL LADLE  

作　　者：Z.H.Jiang 1) ,Y.He 2) ,X.L.Jiang 1) , G.J.Han 1) and S.S.Rui 1) 1) Department of Iron & Steel Metallurgy, School of Material and Metallurgical Science, Northeastern University, Shenyang 110006, China 2) Institute of Metal Research,T 

出　　处：《Acta Metallurgica Sinica(English Letters)》1999年第5期1125-1129,共5页金属学报（英文版）

摘　　要：The thermal conductivities of different typical species filling materials for sliding gate systems for steel ladles were measured using a hot wire technique, and the relationships between thermal conductivity and temperature were regressed. The factors affecting thermal conductivity were analyzed by using variance analysis for a perpendicular experiment. The effects of thermal conductivity on sliding gate free tapping were studied, and it was revealed that decreasing the thermal conductivity of the filling materials is beneficial in enhancing the rate of free tapping for sliding gates.The thermal conductivities of different typical species filling materials for sliding gate systems for steel ladles were measured using a hot wire technique, and the relationships between thermal conductivity and temperature were regressed. The factors affecting thermal conductivity were analyzed by using variance analysis for a perpendicular experiment. The effects of thermal conductivity on sliding gate free tapping were studied, and it was revealed that decreasing the thermal conductivity of the filling materials is beneficial in enhancing the rate of free tapping for sliding gates.

关 键 词：filling materials thermal conductivity sliding gate free tapping 

分 类 号：TF703[冶金工程—钢铁冶金]