Thermal Stress Behavior of Diffusion-bonded SiC/6061Al Laminates during Thermal Cycling  

作　　者：Li, Huan  Li, Jiabao  Wang, Zhongguang  Jiang, Chuanhai  Wang, Dezun 

机构地区：[1]Acad Sinica, Inst Met Res, State Key Lab Fatigue & Fracture Mat, Shenyang 110015, Peoples R China [2]Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150001, Peoples R China

出　　处：《Journal of Materials Science & Technology》1999年第2期117-120,共4页材料科学技术（英文版）

摘　　要：In addition to the study of thermal stress behavior, the stress relaxation at elevated temperature (205 degree C) was also investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061 Al layer takes place during thermal cycling, and the same closed stress temperature loop is formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061 Al layer at 205 degree C within the range of 0.5-16 h, and which is nearly unchanged with further prolongation of time. (Edited author abstract) 19 Refs.In addition to the study of thermal stress behavior, the stress relaxation at elevated temperature (205 degree C) was also investigated by means of X-ray diffraction. It was found that the elastic and elastoplastic deformation in the 6061 Al layer takes place during thermal cycling, and the same closed stress temperature loop is formed in the second cycling for the aged and low temperature treated specimen. Meanwhile, it was demonstrated that the compressive stress relaxed in 6061 Al layer at 205 degree C within the range of 0.5-16 h, and which is nearly unchanged with further prolongation of time. (Edited author abstract) 19 Refs.

分 类 号：TG111[金属学及工艺—物理冶金]