SYNTHESIS OF A NEW SILICONE-CONTAINING BISMALEIMIDE COPOLYMER RESIN  

作　　者：旷文峰 蔡兴贤 江璐霞 

机构地区：[1]Chengdu Institute of Organic Chemistry, Chinese Academy of Sciences, Chengdu 610041 [2]Department of Polymer Science and Materials, Sichuan Union University, Chengdu 610065

出　　处：《Chinese Journal of Polymer Science》1997年第3期231-235,共5页高分子科学（英文版）

摘　　要：A copolymer of bismaleimide-diallylbisphenol A-diphenylsilandiol was synthesized and the copolymerisation was studied by using N-phenylmaleimide, bisphenol A and diphenyl-silandiol as model compounds. The copolymer could be well. cured around 200 degrees C, and the cured resins had good thermal stability. In the range of 170-210 degrees C, a higher curing temperature was favorable to obtain more thermal stable resin by reducing the content of diphenylsilandiol cyclo-homopolymer in resin which would spoil its-thermal stability.A copolymer of bismaleimide-diallylbisphenol A-diphenylsilandiol was synthesized and the copolymerisation was studied by using N-phenylmaleimide, bisphenol A and diphenyl-silandiol as model compounds. The copolymer could be well. cured around 200 degrees C, and the cured resins had good thermal stability. In the range of 170-210 degrees C, a higher curing temperature was favorable to obtain more thermal stable resin by reducing the content of diphenylsilandiol cyclo-homopolymer in resin which would spoil its-thermal stability.

关 键 词：BISMALEIMIDE diallybisphenol A diphenylsilandiol COPOLYMER 

分 类 号：TQ320[化学工程—合成树脂塑料工业]