真空气相反应烧结法制备金刚石-碳化硅复合材料  

Preparation of Diamond/SiC Composites by Vapor Vacuum Reactive Infiltration Sintering Process

作　　者：马安[1] 何新波[1] 杨振亮[1] 吴茂[1] 章林[1] 刘荣军[2] 胡海峰[2] 张玉娣[2] 曲选辉[1] 

机构地区：[1]北京科技大学,北京100083 [2]国防科技大学,湖南长沙410073

出　　处：《稀有金属材料与工程》2013年第S1期248-251,共4页Rare Metal Materials and Engineering

基　　金：国家自然科学基金(51274040);中央高校基本科研业务费专项资金(FRF-TP-10-003B)

摘　　要：金刚石-碳化硅复合材料具有热导率高、热膨胀系数匹配、轻质、高硬度、物理化学稳定性好等特点,是理想的电子封装材料,因而近年来受到广泛关注。真空气相反应渗透工艺是在真空条件下将蒸气通入预制的多孔基体中发生化学反应,从而获得致密化的复合材料,该工艺具有周期短、效率高、成本低、对设备要求低、近净成形等特点。以酚醛树脂为粘结剂,Si作为渗料,采用真空气相反应渗透工艺制备了金刚石-碳化硅复合材料。讨论了金刚石含量,压制压力和基体孔隙率的关系。通过XRD、SEM等手段分析了材料的物相组成、显微结构以及渗透过程。实验结果表明,材料由金刚石,碳化硅,少量残留硅三相组成,碳化硅在金刚石表面附着,结合比较紧密,材料具有很高的致密度和导热性能。压制压力和孔隙率之间呈现负相关,金刚石含量和孔隙率之间呈现正相关。混合粒径金刚石制备的复合材料中金刚石的含量明显提高,材料的热导率最高达到了620W/(m·K)。Diamond/SiC composites exhibit high thermal conductivity, adjustable thermal expansion coefficient, lightweight, high hardness, high physical and chemical stability, which is the ideal material for electronic packaging, and thus has attracted widespread attention in recent years. Vacuum vapor reaction infiltration process is a complex chemical reaction that the steam pass into the prefabricated porous matrix, obtaining densified composite under vacuum conditions. The process is confirmed as time saving, high efficiency, low cost, and suitable for near net shaping. This article aims to prepare diamond/SiC composites using the vacuum vapor reaction infiltration process. The phase composition, microstructure as well as the infiltration process were investigated by XRD and SEM analysis. The effect of content of diamond, and compacting pressure on porosity of the preforms was discussed. The results show that the composites consist of diamond, SiC, and a small amount of silicon. Interfacial bonding between SiC and diamond is strong, and no obvious pores are observed. As a result, high thermal conductivity diamond/SiC composites are achieved. The compaction pressure express negative correlation with porosity, while diamond content and porosity are positive correlated. The content of diamond of the composites prepared by bimodal particle size diamond is increased obviously. The thermal conductivity of the composite can reach 620 W/(m·K).

关 键 词：金刚石-碳化硅 真空气相反应渗透 孔隙率 显微结构 

分 类 号：TB332[一般工业技术—材料科学与工程]