铜含量对脉冲偏压电弧离子镀Zr-Cu-N薄膜结构与性能的影响(英文)  

Influence of Cu Content on the Structure and Properties of Zr-Cu-N Films Deposited by PBAIP

作　　者：张林[1,2] 林国强[1] 马国佳[1,2] 魏科科[1] 

机构地区：[1]大连理工大学三束材料改性教育部重点实验室,辽宁大连116024 [2]北京航空制造工程研究所高能束流加工技术重点实验室,北京100024

出　　处：《稀有金属材料与工程》2013年第S2期87-90,共4页Rare Metal Materials and Engineering

基　　金：National Nature Science Foundation of China(50824001)

摘　　要：利用脉冲偏压电弧离子镀设备调控分离靶弧流,在高速钢和Si基体上沉积了不同铜含量的Zr-Cu-N薄膜。采用EPMA、XRD、纳米压痕以及摩擦磨损试验机研究铜含量对薄膜的组分、结构、力学性能和摩擦学性能。研究表明:Zr-Cu-N薄膜结构主要依赖于铜含量;铜对作为软质相能有效地抑制ZrN晶粒的生长;随着铜含量的增加,薄膜硬度和弹性模量逐渐降低,最高分别为35.5和390.6 GPa,而摩擦系数先增加后减小,最低为0.15。A series of Zr-Cu-N composite films were deposited using a pulsed bias arc ion plating system.The composition,structure,mechanical and tribological properties of the films were investigated by electron probe micro-analyzer(EPMA),X-ray diffraction(XRD),nano-indentation and reciprocating sliding wear tests,respectively.The results show that the structure of Zr-Cu-N films strongly depends on the Cu contents.Cu plays an important role as soft metal phase to refine grain size of ZrN crystallite during the film growth.The hardness and modulus decrease with increasing Cu content,reaching the maximum value of 35.5 and 390.6 GPa,respectively.The friction coefficient of films first increases and then decreases with increasing Cu content.

关 键 词：Zr-Cu-N薄膜 结构 力学性能 电弧离子镀 

分 类 号：TG174.4[金属学及工艺—金属表面处理]