基体温度与底层厚度对EB-PVD热障涂层性能的影响(英文)  

Effects of Substrate Temperature and Bond Coat Thickness on the Life of TBCs in EB-PVD Process

作　　者：武洪臣[1] 苏林[1] 雷新更[1] 

机构地区：[1]中航工业北京航空制造工程研究所,北京100024

出　　处：《稀有金属材料与工程》2013年第S2期148-150,共3页Rare Metal Materials and Engineering

摘　　要：采用EB-PVD工艺在高温合金基体上制备了不同基体预热温度、不同粘结层厚度的YSZ热障涂层。实验结果显示,对于MCrAlY类涂层,EB-PVD工艺存临界温度650～700℃,低于此温度粘结底层不易附着成形。对面层而言,沾水热冲击试验显示,较好的基体温度在800～900℃范围。不同厚度粘结层的TBC抗氧化行为结果显示,在一定范围内,涂层抗高温氧化的寿命随底层厚度增加而增加。因此实际工作中,在其他条件允许的情况下,应可能使底层有足够的厚度。Zirconia based TBCs(thermal barrier coatings) with different substrate temperature and thickness of bond coating were prepared by EB-PVD process.The relationship between the cyclic life of TBCs with the substrate temperature and bond coat thickness was investigated.The results show that there is a critical substrate temperature range of 650～700 oC and for the YSZ top the proper temperature is near 800～900 oC.TBCs life time will be elongated with the increasing of bond coat thickness in a certain range.But the life of TBCs is short and distributed irregularly when the bond coating is too thin.So in practice,the bond coating should be made as thick as possible under condition limitation.

关 键 词：碳/碳复合材料 涂层 TaSi2 SiC:电子束物理气相沉积 热障涂层 粘结层 失效 

分 类 号：TG174.4[金属学及工艺—金属表面处理]