微孔机械加工工艺研究  

Mechanical processing of micro-via

作　　者：杨成君 曾平 黄贤权 

机构地区：[1]深圳市景旺电子股份有限公司,广东深圳518102

出　　处：《印制电路信息》2013年第S1期91-95,共5页Printed Circuit Information

摘　　要：随着印制电路板终端产品集成度要求越来越高,线路板密度也越来越高,微孔技术应用也越来越广泛,目前微孔多采用镭射加工方式,但镭射钻孔尚无好的方法加工高厚径比产品,并对铜厚、介质层均有限制,导致了加工单一性等问题。微孔机械加工法适用于各类介质层,可制作高厚径产品。本文通过使用新型盖板取代普通铝片、改善及优化钻孔参数、选择适宜的加工设备等方面深入研究,从而解决了微孔加工中孔壁粗糙度过大、易断刀和加工效率过低等问题,实现了0.075 mm孔径的批量制作,达到了微孔产品的批量化。With the higher integration of the electric system, the density of PCB becomes higher and higher,so the micro-via technology is widely used. But now, laser processing is widely used in micro-via, it has some limit about the thick of board and how to drill the through hole etc. Mechanical drill the micro-via by mechanical processing is used to fetch up the bug of the laser processing. This paper developed the mechanical processing to drill the hole which diameter is 0.075 mm, and popularizes by mass production.

关 键 词：微孔 参数 断刀 孔壁粗糙度 

分 类 号：TN41[电子电信—微电子学与固体电子学]