高频板ICD改善方法及钻孔参数优化研究  

Study on improve high-frequency board ICD method and drilling parameters optimization

作　　者：李丰 杨巧云 杜明星 朱拓 

机构地区：[1]深圳崇达多层线路板有限公司,广东深圳518132

出　　处：《印制电路信息》2013年第S1期96-102,共7页Printed Circuit Information

摘　　要：高频高速材料具有优良的介电性能和耐热性,但由于独特的化学性能,该材料在加工中存在很大问题,特别是ICD(内层互连不良)、灯芯、钉头、内层孔壁分离等不良现象。文章通过采用DOE试验优化设计和钻孔参数以改善上述不良问题。High frequency material has excellent dielectric properties and heat resistance, but because of the special chemical properties, this material has a lot of problems in the production process, especially ICD (the inner micro circuit breaker), wick, nail head, the inner hole wall separation and other undesirable phenomena. In this paper, by using the DOE test optimization and design and drilling parameters, it aims to improve the problem.

关 键 词：高频 内层互连不良 灯芯 钉头 

分 类 号：TN41[电子电信—微电子学与固体电子学]