用金相显微镜测量双金属线铜层及镀层厚度  

Measurement for Copper Layer Thickness and Coating Thickness of Bimetallic Wire by Metallographic Microscope

作　　者：刘振虎 戴雅康 

机构地区：[1]大连通发复合线缆科技发展有限公司,辽宁大连116600

出　　处：《电线电缆》2014年第6期8-11,共4页Wire & Cable

摘　　要：阐述了在金相显微镜中测量双金属线铜层及镀层厚度的方法。介绍了金相显微镜的选用、测量装置的组成、测微尺的标定及测量方法、待检试样的制备技术以及影响测量精度的因素。This paper describes measurement for copper layer thickness and coating thickness of bimetallic wire by metallographic microscope. It also introduces the selection of metallographic microscope,composition of measuring equipment,calibration and measurement methods of micrometer,preparation of test sample and the factors affecting accuracy of measurement.

关 键 词：双金属线 铜层厚度 镀层厚度 金相显微镜 测量 

分 类 号：TM24[一般工业技术—材料科学与工程]