退火工艺对W-20%Cu复合材料组织与性能的影响  

Effects of annealed process on microstructure and properties of W-20%Cu composite

作　　者：刘舒[1] 谢敬佩[1] 李继文[1] 孙浩亮[1] 王爱琴[1] 马窦琴[2] 王凤梅[1] 

机构地区：[1]河南科技大学材料科学与工程学院,河南洛阳471003 [2]郑州大学材料科学与工程学院,河南郑州450001

出　　处：《材料热处理学报》2015年第4期34-38,共5页Transactions of Materials and Heat Treatment

基　　金：国家自然科学基金(51371077)

摘　　要：研究了不同退火温度及退火时间对W-20%Cu复合材料微观组织、硬度、抗拉强度、导电率、密度的影响。结果表明,W-20%Cu复合材料退火温度为750~950℃,随温度升高,导电率和硬度先升高后降低;800℃与900℃分别退火0.5~6 h,导电率下降,硬度先升高后降低。800℃×0.5 h时的W-20%Cu复合材料的导电率相对较高,为47.32%IACS(国际退火铜标准),900℃×1 h时材料硬度相对较高,为285 HB。Effects of different annealed temperatures and time on microstructure,hardness,tensile strength,conductivity and density of W-20% Cu composites were studied. Results show that when the annealed temperature is at 750-950 ℃,hardness and electrical conductivity of the composites first increase and then decrease. When the annealed time is at the range of 0. 5-6 h at 800 ℃ and900 ℃,the electrical conductivity of the composites decreases and the hardness first increases and then decreases. The relatively high conductivity of the composites is 47. 32 % IACS when annealing at 800 ℃ for 0. 5 h,and the relatively high hardness is 285 HB when annealed at 900 ℃ for 1 h.

关 键 词：W-20%Cu复合材料 退火 导电率 硬度 机理 

分 类 号：TB33[一般工业技术—材料科学与工程]