化学微蚀刻法和微细电镀法制备微流控芯片金属模具工艺对比研究  

Comparison Between Micro-chemical Etching and Microelectroplating Processes for Preparing Metal Mold of Microfluidic Chip

作　　者：郑文书[1] 郭钟宁[1] 罗红平[1] 江树镇[1] 莫远东 

机构地区：[1]广东工业大学机电工程学院,广州510006

出　　处：《腐蚀科学与防护技术》2015年第3期264-268,共5页Corrosion Science and Protection Technology

基　　金：国家自然科学基金重点项目(U1134003);国家自然科学基金青年项目(51105080);广东省自然科学基金博士启动项目(S2011040003991)资助

摘　　要：针对化学微蚀刻法和微细电镀法制备微流控芯片金属模具进行了工艺对比研究。采用激光共聚焦显微镜分别检测表征由这两种加工工艺制备所得的模具微结构特征,对其侧壁陡度、尺寸均匀性、粗糙度进行对比分析。结果表明,化学微蚀刻法制备的模具微结构的侧壁呈不规则弧形、尺寸均匀性差,表面粗糙度较大(Ra=3.58μm)。而微细电镀法制备的模具微结构的侧壁则呈规则的梯形、尺寸均匀性好,表面粗糙度较小(Ra=0.65μm)。微细电镀法制备的微流控芯片金属模具综合效果比化学微蚀刻好。The features of micro-chemical etching and micro-electroplating processes for preparing metal mold of microfluidic chips have been comparatively studied. The micromorphology of the fabricated molds was characterized in terms of sidewall steepness, dimensional uniformity and surface roughness by means of laser scanning confocal microscopy. The results show that, for the mold fabricated by micro-chemical etching, there exist irregular curved sidewall and worse dimensional uniformity and its surface roughness Rais up to 3.58 μm;by contrast, for the mold prepared by micro- electroplating there exist regular trapezoidal sidewall and better dimensional uniformity and its surface roughness Rais only 0.65 μm. In short, the mold of microfluidic chips fabricated by micro-electroplating is better than that by micro-chemical etching.

关 键 词：化学微蚀刻 微细电镀 侧壁陡度 微流控芯片模具 

分 类 号：TG76[金属学及工艺—刀具与模具]