在不同pH值模拟酸雨溶液中纯铜的腐蚀行为  

Corrosion Behavior of Pure Copper in Simulated Acid Rain of Different pH

作　　者：钟万里 聂铭 梁永纯 马元泰[2] 李瑛[2] 

机构地区：[1]广东电网有限责任公司电力科学研究院,广州51000 [2]中国科学院金属研究所,沈阳110016

出　　处：《材料研究学报》2015年第1期60-66,共7页Chinese Journal of Materials Research

基　　金：广东电网公司项目K-GD2013-0498002-001资助~~

摘　　要：使用电化学阻抗(EIS)、X射线光电子能谱(XPS)和扫描电子显微镜(SEM)等手段,研究了纯铜在不同p H值模拟酸雨溶液中的腐蚀行为。结果表明,在不同p H值的模拟酸雨溶液中纯铜的阻抗谱特征有很大差异,说明纯铜有不同的腐蚀机制。XPS分析结果表明,在模拟酸雨溶液的p H值为3时纯铜表面主要生成Cu2O,p H值为5时表面主要生成Cu O,p H值为6时表面生成Cu2O和Cu O的混合物。O2和H+共同影响纯铜的腐蚀历程,在低p H值环境中腐蚀的控制步骤是溶解氧通过双电层的扩散,H+的存在起促进作用。随着p H值的升高H+的促进作用逐渐减弱,纯铜的腐蚀主要受氧的去极化过程控制。The corrosion behavior of pure copper in simulated acid rain of different p H was investigated by using electrochemistry impedance spectroscopy(EIS) and X- ray photoelectron spectroscopy(XPS) as well as SEM. The results show that the impedances of pure copper in simulated acid rain of different p H present various characteristic, indicating the different corrosion mechanisms. The results of XPS show that cuprous oxide only form on the surface of pure copper in p H=3 solution and cupric oxide only exist in p H=5 solution as well as the mixture of both oxides appear in p H=6 solution. The diffusion of O2 and H+through solution may influence the corrosion process of pure copper. In low p H solution, the diffusion of dissolved oxygen through double electric layer is the rate-controlling step due to the promotion of the hydrogen ion. With increase of p H value, the oxygen of depolarization effect mainly control the corrosion process of pure copper without the effect of hydrogen ion.

关 键 词：金属材料 材料失效与保护 纯铜 酸雨 腐蚀 扩散 

分 类 号：TG172[金属学及工艺—金属表面处理]