低热导率磷酸锆结合氮化硅多孔陶瓷的制备(英文)  

Preparation of Zirconium Phosphate Bonded Silicon Nitride Porous Ceramics with Low Thermal Conductivity

作　　者：陈斐[1] 吴俊彦[1] 沈强[1] 张联盟[1] 

机构地区：[1]武汉理工大学,材料复合新技术国家重点实验室,武汉430070

出　　处：《硅酸盐学报》2015年第3期261-267,共7页Journal of The Chinese Ceramic Society

基　　金：国家自然科学基金(51202171,51472118);中国高等学校博士点科研基金(20120143120004);高等学校学科创新引智计划(B13035)资助

摘　　要：采用无压烧结工艺制备Zr P2O7结合Si3N4多孔陶瓷,研究了孔隙率对材料抗弯强度和热导率的影响。结果表明:当孔隙率为20%~43%时,热导率为0.4~1.9 W/(m·K);当孔隙率为20%时,热导率下降至1.9 W/(m·K),但力学性能并没有明显降低。当Effective Medium Theory模型的比例系数为0.3、Maxwell-Eucken 2模型的比例系数为0.7时,计算所得热导率与实验结果相符。Zr P2O7 bonded ?-silicon nitride(?-Si3N4) porous ceramics were prepared via pressureless sintering. The effect of porosity on the bending strength and thermal conductivity of the obtained samples was investigated. The results show that the thermal conductivity of the porous ceramics is in the range of 0.4–1.9 W/(m·K) when the porosity changes from 20% to 43%. The thermal conductivity of the sample is 1.9 W/(m·K) and the mechanical property does not reduce when the porosity is 20%. Also, the calculated thermal conductivity is in reasonable agreement with the experimental results when the proportional coefficients of the effective medium theory model and the Maxwell-Eucken 2 model are 0.3 and 0.7, respectively.

关 键 词：氮化硅多孔陶瓷 热导率 力学性能 

分 类 号：TQ174.75[化学工程—陶瓷工业]