LED封装用有机硅材料的制备与性能  被引量:9

Preparation and Performance of Silicone Materials for LED Encapsulation

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作  者:李媛[1] 赵苗[1] 李光[1] 冯亚凯[1] 谭晓华 韩颖 孙绪筠 

机构地区:[1]天津大学化工学院,天津300072 [2]天津德高化成新材料股份有限公司,天津300451

出  处:《高分子材料科学与工程》2015年第1期41-45,50,共6页Polymer Materials Science & Engineering

基  金:天津市科技支撑计划项目(14ZCZDGX00010)

摘  要:以γ-(2,3环氧丙氧)丙基三甲氧基硅烷(KH560)和二苯基硅二醇(DPSD)为原料通过缩聚反应制备出带有苯基和环氧基团的高折光指数有机硅聚合物。研究了催化剂、反应温度、反应时间、反应物的摩尔比对苯基环氧基有机硅聚合物性能的影响,确定出最佳反应条件——反应温度为50℃,反应时间为12h,反应物KH560和DPSD的摩尔比为1∶1。通过傅里叶变换红外光谱和核磁共振对其结构进行了表征。与甲基六氢苯酐固化后得到透明的有机硅封装材料,并对固化后的有机硅封装材料进行了耐热性能和力学性能的表征。结果表明,有机硅封装材料具有较高的折光指数(1.547),较高的透光率(95%),优异的粘接性、良好的耐热性(热分解温度>290℃)以及力学性能,可以用于发光二极管(LED)封装领域。High refractive index organic silicone material containing phenyl and epoxy groups was prepared by condensation polymerization reaction usingγ-(2,3-epoxypropoxy)propyltrimethoxysilane(KH560)and diphenylsilanediol(DPSD).The influences of reaction factors such as catalyst,reaction temperature,reaction time and phenyl content on the organic silicone materials were investigated.The preferred reaction conditions are reaction temperature 50 ℃,reaction time 12 h,mole ratio of KH560 and DPSD 1∶1.The structure of materials was characterized by FT-IR and 1 H-NMR.The thermal resistant properties and mechanical properties of transparent organic silicone encapsulating materials were investigated after using hexahydro-4-methylphthalic anhydride(MeHHPA)as curing agent.The results show that the organic silicone encapsulating materials have higher refractive index(1.547),higher transmittance(99%),excellent adhesion,good heat resistant(thermal decomposition temperature>290 ℃)and mechanical properties.This high refractive index organic silicon material containing phenyl and epoxy groups might be applied for light emitting diodes(LED)encapsulation.

关 键 词:LED封装 有机硅 苯基 环氧基 高折光指数 

分 类 号:TQ264.1[化学工程—有机化工]

 

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