液态金属填充型硅脂导热性能实验研究  

Experimental Investigation on the Heat Dissipation Performance of Liquid Metal Filled Thermal Grease

作　　者：梅生福 高云霞[1,2] 邓中山[1,2] 刘静[1,2] 

机构地区：[1]中国科学院低温工程学重点实验室,中国科学院理化技术研究所,北京100190 [2]低温生物医学工程学北京市重点实验室,中国科学院理化技术研究所,北京100190

出　　处：《工程热物理学报》2015年第3期624-626,共3页Journal of Engineering Thermophysics

基　　金：国家自然科学基金资助项目(No.51301186);中国科学院科研装备研制项目(No.YZ201234)

摘　　要：目前,市售热界面材料一般由固体颗粒和硅油复合制备而成,其普遍存在导热性能差的问题。本文首次提出了一种以室温液态金属流体作为导热填充材料、硅油为基体的新型复合导热硅脂。在前期研究的基础之上,采用对照实验的方法研究了在四种不同的热流密度下,液态金属填充型导热硅脂的实际导热性能。实验结果表明,该新型导热硅脂可大幅降低热源与热沉之间的接触温差,有望实际应用于各类高功率密度电子设备之中。The commercially available thermal greases commonly present relatively low thermal conductivity,which usually consist of solid particles and silicone oil base.In this study,the roomtemperature liquid metal(Ga_(67.5)In_(20.5)Sn_(20.5),also called Galinstan) was firstly proposed as a new kind of liquid filler in silicone oils for making high performance thermal greases.Based on our former works,the heat dissipation performance of hquid metal filled thermal grease was investigated under four different heat fluxes using contrast experimental method.The results indicated that the obtained thermal grease is very effective in reducing the thermal contact temperature differences between the heat source and heat sink.This new kind of liquid metal filled thermal grease is expected to be practically used in various high power electronic devices in the near future.

关 键 词：热界面材料 复合导热硅脂 液态金属 电子冷却 

分 类 号：TQ264.1[化学工程—有机化工]