化学镀Ni—W—P三元合金的研究  

A Study on Chemical Plating of Nickel-Tungsten-Phosphorus Ternary Alloy

作　　者：覃奇贤[1] 栾本利 杨秀敏[1] 

机构地区：[1]天津大学应用化学系,300072

出　　处：《电镀与精饰》1993年第3期7-10,共4页Plating & Finishing

摘　　要：采用化学镀技术,通过改变主盐、还原剂及络合剂的浓度以及操作条件,成功地制备了含W量为5.5％、含P量为12.3％的Ni-W-P合金镀层。其沉积速度为11μm/h。文中以化学镀镍基合金的电化学机理为依据。This paper reports that a nickel-tungsten-phosphorus ternaty alloy coating containing 5.5wt% w and 12.3wt% p has been successfully prepared using chemicalplating technique with varying the plating bath composition such as the concentrations of nickel salt, complexing agent and reductant and changing the operation conditions. The deposition rate of the ternary alloy coating up to 11μm/h can be obtained. Factors affecting the content of W and P in the Ni-W-P ternary alloy coating are also analysed in this paper according to the electrochemical mechnism of the chemical plating process of nickel base alloys.

关 键 词：化学镀 镍钨磷合金 镀层 

分 类 号：TQ153.2[化学工程—电化学工业]