热处理对Ni-P镀层内应力及结合强度的影响  

Effects of Heat Treatment on the Internal Stress and Adhesion of Ni-P Coating

作　　者：谢华[1] 陈文哲[2] 钱匡武[2] 

机构地区：[1]福州大学机电学院 [2]福州大学材料科学与工程学院,福建福州350002

出　　处：《电镀与环保》2004年第3期13-15,共3页Electroplating & Pollution Control

摘　　要：采用薄片弯曲法和压痕法分别研究了热处理温度对化学镀镍层的内应力以及镀层与基体的结合强度的影响规律。结果表明 :镀层的内应力为拉应力 ;当热处理温度为 2 0 0℃时 ,内应力减小 ,镀层经过 30 0、4 0 0或 6 0 0℃热处理 ,内应力逐步增大。随热处理温度升高 。Effects of heat treatment on the internal stress of Ni P coating deposited from electroless plating and the adhesion between the coating and substrate are studied respectively by using thin film flexural and indentation methods. The results show that the internal stress of Ni P coating is tension stress, which will decrease when heat treated at 200 ℃ , and will gradually increase when heat treated at 300 ℃ , 400 ℃ or 600 ℃ ; the adhesion between Ni P coating and substrate will increase as the temperature of heat treatment goes up.

关 键 词：NI-P镀层 热处理工艺 薄片弯曲法 压痕法 化学镀工艺 内应力 

分 类 号：TQ153[化学工程—电化学工业]