化学镀无铅的锡基二元合金的研究和应用  

A Study of Electroless Lead-free Tin-base Binary Alloys Plating

作　　者：张景双[1] 潘莉[1] 黎德育[1] 屠振密[1] 

机构地区：[1]哈尔滨工业大学"威海"海洋系,山东威海264209

出　　处：《电镀与环保》2004年第3期16-18,共3页Electroplating & Pollution Control

摘　　要：化学镀无铅的锡基二元合金镀层如Sn Ag、Sn Bi、Sn In、Sn Sb、Sn Zn等 ,它们常具有优良的可焊性和耐烛性 ,故多用在印制板和其它电子领域 ,以取代含铅的锡合金 ,而锡 锌合金又可作为代镉镀层 ,有利于环境保护。以上这些锡基二元合金镀层可从适宜的化学镀液组成和工艺条件下得到 。Coatings from lead free electroless tin base binary alloy plating, such as Sn Ag, Sn Bi, Sn In, Sn Sb, Sn Zn, etc., possess excellent solderability and corrosion resistance, so are often applied to printed circuit board and other electronics fields to replace tin alloy containing lead. In addition, Sn Zn alloy can also be used as a substitute for cadmium, which is helpful to environmental protection. The above tin base binary alloys coatings can be obtained from appropriate electroless bath compositions and operating conditions, which are also discussed.

关 键 词：化学镀工艺 锡基二元合金 铅 化学镀液 丙烯基硫脲 

分 类 号：TQ153.2[化学工程—电化学工业]