厚膜微调技术及发展趋势  

Trimming technologies for thick film and their development

作　　者：李文娟[1] 田兴志[1] 

机构地区：[1]中国科学院长春光学精密机械与物理研究所,吉林长春130033

出　　处：《光机电信息》2004年第6期29-34,共6页OME Information

摘　　要：介绍了厚膜电阻常用的喷砂微调和脉冲电压微调、激光微调三种微调技术及其发展趋势,重点介绍了激光微调机理、调阻方式以及微调图形分类。与喷砂和脉冲电压微调技术相比,激光微调具有精度高、速度快、效率高的特点,因而具有广阔的发展前景。Thie paper describes the abrasive trimming, pulse voltage trimming and laser trimming technologies for thick film and their evolutions. Trimming principle, mode and type of laser trimming are described in detail. Compared with the alternative methods, such as abrasive trimming, pulse voltage trimming, laser trimming provides high accuracy, speed, efficiency, and has wide applications.

关 键 词：厚膜电阻 厚膜微调 喷砂微调 脉冲电压微调 激光微调 集成电路 

分 类 号：TN44[电子电信—微电子学与固体电子学]