高性能电子溅射靶的制备  

Preparation of electronic sputtering target with high performance

作　　者：吴胜文[1] 葛启录[1] 褚征军[1] 

机构地区：[1]安泰科技股份有限公司,北京100081

出　　处：《粉末冶金技术》2004年第2期87-90,共4页Powder Metallurgy Technology

摘　　要：大尺寸、高性能电子溅射靶是电子及信息产业不可或缺的材料 ,电子靶材一直是各国优先发展的高新技术材料。此光盘膜用靶材材料极易在制备过程中碎裂 ,并且密度越高 ,裂纹倾向越大。因此 ,高密度、高纯度、大尺寸是相互矛盾的 ,难以达到完美的统一。通过选择合适的成分配比、粉原料的预处理以及合理的热压工艺以及热等静压工艺制度 ,解决了制备过程中易出现裂纹的难题 ,制备了大尺寸 (直径 2 0 0mm)、高相对密度 (大于 90 % )、高纯度、密度分布均匀和组成相满足使用要求的靶材。经镀膜考核 ,靶材各项性能指标能够达到镀膜使用要求 ,与国外同类产品相当。Large-size electronic sputtering targets with high performance are essential high-tech materials for electronic and information technology and the priority to their development is given in many countries. The target material used for video disk is liable to fracture in production, and the higher the density is, the stronger the fracture tendency is. It is difficult to obtain the large-size target material with high density and high purity. A large-size (200 mm in dia.) target material was produced through selection of proper composition, preprocessing of powder, reasonable processing conditions for HP and HIP with the fracture problem being solved, density higher (> 90%), density distribution even, purity high and application requirement being met. Tests show that it is comparable to foreign products of same type.

关 键 词：电子溅射靶 制备 热等静压 热压工艺 粉末冶金 

分 类 号：TF12[冶金工程—粉末冶金]