基于小波变换Cu-W薄膜表面形貌表征与硬度值分散性评价  

Morphological characterization and nanoindentation hardness scatter evaluation for Cu-W thin films based on wavelet transform

作　　者：汪渊[1] 白宣羽[1] 徐可为[1] 

机构地区：[1]西安交通大学金属材料强度国家重点实验室

出　　处：《物理学报》2004年第7期2281-2286,共6页Acta Physica Sinica

基　　金：国家自然科学基金重点项目 (批准号 :5 993 10 10 );国家教育部骨干教师基金资助的课题~~

摘　　要：提出了一种基于小波变换描述薄膜表面形貌的方法 .运用离散小波变换法研究磁控溅射Cu W薄膜表面特征随溅射时间的演变 .结果表明 ,Cu W薄膜在溅射时间超过 6 0 0s时才达到稳定 .不同薄膜表面形貌的变化主要是由高频部分引起 .薄膜的粗糙表面会引起纳米压入硬度值的分散 ,这种分散性可用基于小波变换的薄膜表面形貌多尺度分解评价 .A strategy based on wavelet transform to describe surface morphology of thin films is presented in this paper. The evolution of surface morphology of Cu-W thin films with deposition time on silicon wafers was investigated by discrete wavelet transform (DWT) method. The results show that the surface morphology of the thin films is unstable until the sputtering time exceeds 10 min. The surface morphology variation of different thin films can be distinguished primarily by high frequency signals. A scattering of the nanoindentation hardness values, which results from the roughness of the thin films surface, can be characterized by the roughness defined by the surface texture based on wavelet transform.

关 键 词：铜-钨薄膜 小波变换 表面形貌表征 硬度值 纳米压入 分散性 

分 类 号：O484[理学—固体物理]