无刻蚀镀铁交流活化机理的研究  

Study on A. C. Activating Mechanism of Iron Plating Without Etching

作　　者：李明[1] 崔永植[1] 汪红[2] 

机构地区：[1]东北工学院表面加工技术研究所 [2]表东北工学院面加工技术研究所

出　　处：《东北工学院学报》1993年第2期162-165,共4页

摘　　要：通过考查不对称交流条件下镀铁层电结晶的形貌,研究了无刻蚀镀铁工艺的交流活化机理。结果表明:在交流电作用下镀层呈柱状结晶,表现出低硬度和高塑性。当不对称比β值接近1时,由于镀层将沿基材原晶体外延生长,从而导致金属键的形成。由此解释了无刻蚀镀铁层具有高结合强度的原因。By way of looking at the morphology of electrocrystalline deposit in Fe-plating process without etching under the action of asymmetric alternating current, the A. C. activating mechanism was studied. The results showed that under the action of asymmtric alternating current the Fe-deposit shows columnar crystallines with low hardness and high plasticity. When the asymmetric ratio β approaches to 1 .metallic bonds will form since a crystal growth takes place in deposit along Fe substrate crystals. This gives reason for the high bonding strength of Fe deposit in Fe-plating without etching.

关 键 词：镀铁 电结晶 活化 

分 类 号：TQ153.19[化学工程—电化学工业]