真空电弧熔炼的铜铬触头材料组织性能分析  

Structure and Property Analysis of Copper-chromium Contact Materials Melted with Vacuum Arc

作　　者：梁永和[1] 张明江[1] 陈名勇 

机构地区：[1]桂林电器科学研究所,广西桂林541004

出　　处：《高压电器》2004年第3期191-194,共4页High Voltage Apparatus

摘　　要：论述了铜铬触头的金相组织与形成机理、金相组织对电气性能的影响及影响结晶组织的工艺因素,阐明了电弧熔炼法铜铬触头材料具有铬在铜基体中呈均匀细小弥散分布的铜铬组织;在开断能力、抗熔焊性、介质恢复强度等电气性能方面均明显优于传统粉末冶金法铜铬触头材料。This paper describes the microstructure of copper-chromium contact and forming mechanism, the process factors affecting the crystallized structure as well as the influence of microstructure on electric properties. The copper-chromium contact melted with vacuum arc has the microstructure of homogeneous and fine chromium particles distributed dispersively in copper basis. The contact has many advantages in breaking capacity, anti-welding behaviour and dielectric recovery strength, compared with traditional powder metallurgy copper-chromium contact.

关 键 词：真空电弧熔炼 铜铬触头 金相组织 

分 类 号：TM503[电气工程—电器]