CL-20与树形分子键合剂的粘附性能研究  

Study on Interaction between CL-20 and Dendritic Bonding Agent

作　　者：潘碧峰[1] 罗运军[1] 谭惠民[1] 

机构地区：[1]北京理工大学材料科学与工程学院,北京100081

出　　处：《含能材料》2004年第4期199-202,共4页Chinese Journal of Energetic Materials

摘　　要：通过使用扫描电镜(SEM),X射线光电子能谱(XPS)技术来研究树形分子键合剂(DBA)对CL 20晶体的粘附性能及其界面相互作用机理。实验表明了树形分子键合剂可以在CL 20表面形成一层吸附层,具有良好的粘附性能,X射线光电子能谱的化学位移也表明了键合剂与CL 20的N元素发生诱导效应。A dendritic bonding agent (DBA) that can adhere to CL-20 effectly is reported. The adhesive properties are characterized by scanning electronic microscope (SEM) and X-ray photoelectron spectroscopy (XPS). DBA forms a layer of viscous film on the surface of CL-20; the adhesive degree measured by XPS analysis can be up to 22.87%, the adhesive degree increases by increasing of COOCH_3 group content due to the inducing interaction between N and O.

关 键 词：材料学 树形分子键合剂(DBA) CL-20 粘附性能 

分 类 号：TQ560[化学工程—炸药化工]