超声对铜电化学沉积速度及沉积产物结构的影响  

Effects of Ultrasound on Rate and Characterization of Copper Electrodeposition

作　　者：王雅琼[1] 傅相林[1] 许文林[1] 李敏[1] 张小兴[1] 

机构地区：[1]扬州大学化学化工学院,江苏扬州225002

出　　处：《过程工程学报》2004年第4期305-309,共5页The Chinese Journal of Process Engineering

基　　金：国家自然科学基金资助项目(编号:20176047);江苏省高校自然科学研究计划资助项目(编号:03KJB530164)

摘　　要：测定了超声作用下铜电化学沉积过程的阴极稳态极化曲线,探讨了超声对沉积铜晶面取向及表面形貌的影响. 结果表明,在实验条件下,超声可以提高铜电化学沉积过程的阴极极限扩散电流密度,超声对铜电化学沉积过程极限扩散电流密度的影响随着反应体系温度的升高而下降,当系统温度从25oC升高到55oC时,有超声与无超声作用下的平均极限扩散电流密度的比值从14.1减低到8.4. 超声还能改变铜电沉积晶面的取向,明显改变电沉积铜的粒径.The current-potential curves for copper electrodeposition were measured in the presence and in the absence of ultrasound. The effects of ultrasound on the crystal orientation and surface morphology were discussed in the copper electrochemical reduction. The experimental results showed that the mass-transfer-controlled current density of the electrochemical reduction of copper ions remarkably increased in the presence of ultrasound. The influence of ultrasound on the average limiting current density decreased with increasing temperature. The average current density in the presence of ultrasound was about 14-fold than that in the absence of ultrasound at 25oC. Otherwise, the ratio of the current density with ultrasound to that without ultrasound was 8.4 at the temperature of 55oC. Ultrasound could change texture coefficient in the process of copper electrodeposition. The texture coefficient of 200 was improved with increasing time under the condition of ultrasonic irradiation. The electrodeposited grain size was also decreased in the presence of ultrasound.

关 键 词：超声 电化学沉积 晶面取向 

分 类 号：TQ153.14[化学工程—电化学工业]