超声电沉积制备纳米铜粉末的机理研究  

An Investigation on the Mechanism of Nano-copper Preparation with Ultrasonic Wave Electrodeposit

作　　者：李淼[1] 喻建胜[1] 蒋渝[1] 陈家钊[1] 涂铭旌[1] 

机构地区：[1]四川大学材料学院金属材料系,四川成都610065

出　　处：《材料开发与应用》2004年第3期12-15,共4页Development and Application of Materials

摘　　要：利用超声电沉积法制备金属纳米铜粉,平均粒径30nm,分散性较好;利用XRD、TEM等进行了成分、粒度、形貌及结构分析,对影响纳米粉末制备的主要工艺因素进行分析和优化。试验表明,电流密度对纳米粉末形成起控制作用,表面活性剂和超声场对粉末分散更为重要。The copper nano-powder with average size 30nm and good dispersity is prepared by means of ultrasonic wave electrodeposit.The composition,size,morphology and microstructure of the powder are analyzed with XRD,TEM etc, and the technical factors are optimized. The test results indicate that the electric current density dominates the forming of the nano-powder whereas the surface active agent and ultrasonic wave have great influence on scattering of the powder.

关 键 词：超声波 电沉积 纳米粉末 电流密度 表面活性剂 

分 类 号：TB383[一般工业技术—材料科学与工程]