硅烷偶联剂的种类与结构对二氧化硅表面聚合物接枝改性的影响  

INFLUENCE OF THE KINDS AND STRUCTURE OF SILANE COUPLING AGENT ON POLYMER GRAFTING MODIFICATON OF THE ULTRAFINE SILICON DIOXIDE SURFACE

作　　者：毋伟[1] 陈建峰[1] 屈一新[1] 

机构地区：[1]北京化工大学教育部超重力工程研究中心,北京100029

出　　处：《硅酸盐学报》2004年第5期570-575,共6页Journal of The Chinese Ceramic Society

基　　金：教育部科学技术研究重大项目(0202);天津市重点项目

摘　　要：在超细二氧化硅表面接枝聚合改性工艺的基础上,通过透射电子显微镜、红外光谱、X射线光电子能谱等检测手段,并结合模型计算,研究了硅烷偶联剂(silanecouplingagent)对超细二氧化硅表面聚合物接枝改性的影响及其机理。认为硅烷偶联剂KH570和KH858都是有效的预处理剂,硅烷偶联剂的种类对改性影响很大。由于KH570中含有的双键与羰基形成了离域П44键,使其双键结合力减弱;而在KH858中由于硅原子的供电子效应,使其双键结合力有所加强;使用KH570预处理的超细二氧化硅表面含有的聚合物更多,分散性更好。KH570更适合用作超细二氧化硅表面接枝聚合改性的预处理剂。Based on the study of the process of polymer grafting modification on the surface of ultrafine silicon dioxide and compared by using TEM, IR, XPS, and model calculation, the influence and mechanism of different silane coupling agents on the modification of ultrafine silicon dioxide were investigated.The effects of modification are varied significantly with the difference of silane coupling agents, and it is concluded that KH570 and KH 858 are effective pretreating agents. The duplex bonds of carbon in KH570 are weakened due to the formation of П44 delocalization bonds between the duplex bonds and carbonyl groups, whereas the duplex bonds of carbon in KH858 are strengthened due to the electron donating effects of silicon atoms. The surface of ultrafine silicon dioxide modified with KH570 hence contains more polymers and has better dispersion. It is suggested that KH570 is more suited as a pretreating agent for polymer grafting modification on the surface of ultrafine silicon dioxide.

关 键 词：硅烷偶联剂 超细二氧化硅 接枝改性 影响机理 

分 类 号：TQ127.2[化学工程—无机化工]