有机染料对酸性镀铜电沉积的影响  

Effect of Organic Dye on Acidic Copper Electroplating

作　　者：刘烈炜[1] 吴曲勇[1] 卢波兰[1] 杨志强[2] 

机构地区：[1]华中科技大学化学系,湖北武汉430074 [2]武汉材料保护研究所,湖北武汉430030

出　　处：《材料保护》2004年第7期4-6,13,共4页Materials Protection

摘　　要：　为了有效地研究添加剂对铜电沉积的影响,选择合成了有机染料酸性镀铜添加剂AQ,用旋转圆盘电极动电位扫描、交流阻抗和微分电容等方法研究其对铜离子电沉积过程的影响,得到了铜的电沉积机理。发现这种染料主要影响亚铜离子的放电还原过程,具体表现为染料与亚铜离子形成配位化合物[AQCu(Ⅰ)]吸附在电极表面,阻碍吸附铜原子在晶面扩散结晶的过程。原子力显微镜对镀层微观形貌观察表明,AQ是性能良好的酸性镀铜添加剂。Organic dye AQ was synthesized as an additive in acidic electro plating copper. The effect of additive AQ on the electrodepositing process of Cu^(2+) was studied by dynamic potential scanning of rota ting disc electrode, AC impedance and differential capacity, and the electrodepositing mechanism of copper was confirmed. Re sults discover that the dye mainly affect the discharge reducing process of cuprous ion. The compound AQCu( I ) formed by dye and cuprous ion absorbs on the surface of electrode and prevents the diffusing and crystallizing process of cuprous ion on the crys tal. The morphology of plating by AFM shows that dye AQ is an excellent additive for acidic electroplating copper.

关 键 词：电沉积铜 旋转圆盘电极 交流阻抗 微分电容 原子力显微镜 电极过程 

分 类 号：TQ153.1[化学工程—电化学工业]