化学镀Ni-P合金复合络合剂正交优化试验  

OPTIMIZATION OF TECHNOLOGY OF ELECTROLESS Ni-P ALLOY PLATING PROCESS BY ORTHOGONAL TEST

作　　者：孙华[1] 冯立明[1] 李成美[1] 

机构地区：[1]山东建筑工程学院材料系,济南250014

出　　处：《腐蚀与防护》2004年第7期304-306,314,共4页Corrosion & Protection

摘　　要：确定了化学镀Ni P合金工艺试验技术路线,选取影响工艺性能的5个工艺参数,设计了L16(45)正交试验方案,探讨了各种添加剂化学镀对Ni P合金镀液和镀层性能的影响,用极差法分析了各工艺参数对工艺性能影响的主次顺序,确定了最佳工艺配方。优化验证试验结果表明:该工艺具有镀速高、稳定性好、镀层孔隙率低、硬度高的特点。In order to optimize the technology of electroless Ni-P alloy plating process, a group of orthogonal tests was arranged and carried out to study the effect of five parameters on electroplating technology. The range analysis was employed to distinguish the influence degree of factors included in the tests, and the optimum formula and process were determined. The test results under the optimum conditions show that the technology is featured with fast deposition, stable bath solution, high quality nickel coating and high hardness. The technology has a high potential for commercial application. Key words: Complex agent; Stabilizer; Depositing velocity; Bath solution stability

关 键 词：络合剂 稳定剂 沉积速度 镀液稳定性 

分 类 号：TQ153.2[化学工程—电化学工业]