片式多层陶瓷微波谐振器  

Chip Multilayer Ceramic Microwave Resonators

作　　者：丁士华[1] 姚熹[1] 张良莹[1] 楼旭东[1] 

机构地区：[1]同济大学功能材料研究所,上海200092

出　　处：《压电与声光》2004年第4期280-282,共3页Piezoelectrics & Acoustooptics

基　　金：国家高新技术发展计划(2001AA325110);国家重点基础研究发展计划(2002CB613302);上海市重点建设学科

摘　　要：介绍了片式陶瓷微波谐振器的工艺过程、谐振器的结构以及结构对谐振器参数的影响,谐振器与外电路的耦合采用耦合间隙的方法与谐振单元在同一层内实现,这种新结构既可给制备工艺带来方便,又可减少工艺所带来的误差。用多层陶瓷工艺技术,用高介电常数、低温烧结微波陶瓷实现了中心频率为1GHz,有载品质因数大于80的试验双端口多层微波谐振器。微波谐振器体积小,整个谐振器的尺寸为7mm×2mm×1mm,适用于表面贴装技术。Fabrication process, structure and its effect on parameters of chip multilayer ceramic microwave resonators were presented. A new structure that the coupling of resonators and external circuit can be accomplished at the same layer by coupling gap was used. The new structure is convenient for manufactural process and error can be decreased. A trial multilayer microwave resonators with loaded Q value more than 80, center frequency at about 1GHz was accomplished by microwave ceramic with high permittivity and low sintering temperature. Microwave resonator with small size(Dimension:7 mm× 2 mm×1 mm) is suitable for SMT.

关 键 词：低温烧结 微波陶瓷 微波谐振器 

分 类 号：TN61[电子电信—电路与系统]