中美激光加工领域专利技术发展动态评述  

Review of patents in laser processing in China and America

作　　者：曹葆青[1] 曾晓雁[2] 

机构地区：[1]华中科技大学专利中心,武汉430074 [2]华中科技大学激光技术国家重点实验室,武汉430074

出　　处：《激光技术》2004年第4期346-351,共6页Laser Technology

摘　　要：综述了 1996年至今中国与美国激光加工专利技术的发展动态 ,比较了两国专利数量与质量存在巨大差异的原因。结果表明 ,激光焊接、切割、打孔、标记、退火、微调等技术仍然是近几年内激光加工技术创新的主流 ,而且随着激光器件水平的不断提高 ,应用范围有不断扩大的趋势。加强专利保护意识。The development status of patents in China and America from 1996 to 2002 is reviewed and compared.There is a big difference about the number and quality of patents between China and America.It is found that laser welding,cutting,drilling,marking and annealing were still the main stream for technology creation in the past 7 years,which may even expand bigger with the improvement of laser devices and development of new types of lasers.There are two important points to develop laser processing industry in China: the first is developing new technology geared to the needs of market,the second is strengthening the consciousness of patents and how to use intelligent right to develop new products.

关 键 词：激光加工 专利 发展动态 评述 

分 类 号：G306[文化科学]